Screw valve solder paste application and operation guide
Release time:
2025-04-16 14:00
Source:
Leica Technology
I. Application Scenarios of Screw Valve Solder Paste Dispensing
Screw Valve Solder paste dispensing technology is mainly used in precision dispensing operations on SMT (Surface Mount Technology) production lines, including but not limited to the following aspects:
1. Integrated Circuit Board Soldering: Precisely dispensing solder paste onto integrated circuit boards to provide a uniform and stable soldering medium for subsequent chip soldering.
2. Micro-component Fixation: For tiny electronic components such as chips, resistors, and capacitors, the screw valve is used to dispense a small amount of solder paste to ensure that the components are firmly connected.
3. High-Density Interconnection Boards: In the manufacturing of high-density interconnection boards, the high-precision characteristics of the screw valve are used to achieve solder paste dispensing for complex circuit patterns, improving product reliability and stability.
4. Dispensing Irregular Components: For components with irregular shapes, the screw valve can flexibly adjust the dispensing path and amount to meet personalized dispensing needs.
II. Screw Valve Equipment Selection
Selecting the right screw valve equipment is crucial for ensuring solder paste dispensing quality. The following factors should be considered:
1. Precision and Repeatability: According to product precision requirements, select a screw valve with high precision and good repeatability to ensure consistency in each dispensing.
2. Dispensing Volume Control: According to the component size and welding needs, select a screw valve with adjustable dispensing volume to achieve precise control of solder paste from micro to large amounts.
3. Compatibility and Adaptability: Ensure that the selected screw valve is compatible with existing production line equipment, including the control system and feeding system, to reduce modification costs and complexity.
4. Maintenance and Service: Choose a supplier with good After-sale Service and Powered by to facilitate daily maintenance and troubleshooting of the equipment.
III. Operating Procedures
1. Preparation:
- Check if the screw valve and auxiliary equipment (such as the solder paste feeding system and control system) are intact, and clean the workbench.
- According to process requirements, select the appropriate solder paste and preheat it to the recommended temperature to ensure good solder paste fluidity.
- Program the dispensing path, dispensing volume, speed, and other parameters, and conduct simulation tests if necessary.
2. Equipment Debugging:
- Start the equipment and run it without load to check if the screw valve movement is smooth and without any jams.
- Conduct a small amount of test dispensing to observe whether the solder paste dispensing shape meets expectations, and adjust the parameters until the optimal state is reached.
3. Formal Operation:
- Place the circuit board to be dispensed in the designated position and start the automatic dispensing program.
- Monitor the dispensing process, paying attention to whether the uniformity, position, and amount of solder paste dispensing meet the design requirements.
- Regularly check the solder paste supply and replenish it in time to avoid production interruptions.
4. Finishing Work:
- After dispensing is complete, turn off the equipment power, clean the work area, especially the screw valve head and feeding system, to prevent solder paste solidification and blockage.
- Record the equipment operating status and dispensing quality for future production reference.
IV. Maintenance
1. Daily Cleaning: After each use, promptly clean the screw valve head and feeding system to prevent solder paste residue from causing blockage or corrosion.
2. Regular Inspection: Conduct a comprehensive inspection at least once a month, including electrical connections and mechanical part wear and tear, and replace worn parts in time.
3. Lubrication and Maintenance: Lubricate the moving parts of the screw valve appropriately to ensure smooth operation.
4. Calibration and Adjustment: Regularly calibrate the dispensing accuracy to ensure long-term operational accuracy.
In summary, Screw valve solder paste dispensing technology plays an important role in the electronics manufacturing industry due to its high precision and high efficiency. Through reasonable equipment selection, standardized operating procedures, and meticulous maintenance, the dispensing quality can be significantly improved, ensuring the stability and reliability of product production. It is hoped that this article will provide valuable reference for relevant practitioners, helping to improve production efficiency and product quality.
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How can daily maintenance help extend the service life of a valve body?
As a precision component that operates at high frequency, the precision dispensing valve requires scientific daily maintenance to extend its service life and maintain dispensing accuracy. Shenzhen Laike Technology has compiled the following key maintenance points for you: Daily cleaning is crucial and should not be overlooked. After finishing work, promptly remove any residual adhesive from the exterior of the valve body, especially around the nozzle and plunger area. Once cured, adhesive can cause blockages or wear, affecting subsequent use. It is recommended to gently wipe with a suitable cleaning solvent, taking care not to damage the seals. Regularly inspect sealing components—seals and other parts will naturally degrade over time during prolonged operation. We recommend checking their condition periodically based on usage frequency. If you notice signs of hardening or wear, replace these components promptly to prevent adhesive from seeping into the valve body and causing more serious damage.
The stringing issue during the dispensing process is often closely related to fluid properties, equipment parameters, and process settings. Drawing on years of industry experience, SZLKTE has compiled and optimized key points for you: Fluid temperature control is crucial. Proper heating can reduce the viscosity of the adhesive, improve its flowability, and minimize stringing and trailing. SZLKTE’s dispensing valves can be equipped with precision temperature-control modules to ensure that the fluid remains in a consistently stable working state. The back-suction parameters must be finely adjusted. The negative-pressure back-suction applied at the moment the glue dispensing stops can effectively cut off the adhesive flow, preventing dripping and stringing. We recommend gradually adjusting the amount and speed of back-suction according to the adhesive’s viscosity until you find the ideal balance.
SZLKTE takes a multi-dimensional approach to ensure zero errors and long service life for its products even under high-speed, continuous operation. The piezoelectric valve series employs piezoceramic actuation technology; its non-contact drive design eliminates mechanical wear common in traditional solenoid valves, enabling a service life of over one billion cycles. At the same time, these valves deliver millisecond-level response times, completely eliminating trailing and stringing issues. The needle valve KC-9870, on the other hand, features a specially engineered, wear-resistant material for its needle component, offering exceptional resistance to abrasion and corrosion. Even in industrial environments with prolonged operation, this valve maintains outstanding stability. Moreover, its components can be quickly disassembled and maintained, significantly reducing production downtime.
Contact Dispensing vs. Non-Contact Jetting Valves: How Should You Choose for Micron-Level Processes?
Contact dispensing involves the needle making physical contact with the substrate surface to apply the fluid. Its main advantage lies in its strong adaptability to high-viscosity fluids and relatively controllable dispensing process. However, since it requires coordinated movement along the Z-axis, the dispensing speed is limited. Additionally, there is a risk of the needle colliding with and damaging the workpiece or deforming the needle itself. Therefore, careful evaluation is necessary when applying this method in miniaturized packaging scenarios. In contrast, non-contact jetting valves use a driving mechanism to rapidly spray adhesive onto the workpiece surface without any physical contact between the needle and the substrate. This feature makes them ideally suited for substrates with uneven surfaces or those that are fragile. They excel in micron-scale processes such as bottom-fill applications for chips and precision coating. The jetting method eliminates the need for Z-axis movement, significantly boosting production efficiency while also avoiding common issues associated with contact dispensing, such as stringing and trailing.
The stability of the piezoelectric valve dispensing process directly determines product quality. Common issues such as uneven dispensing, stringing, and glue leakage can be effectively addressed through parameter adjustments and optimized matching. Laike’s piezoelectric valves support multi-level parameter adjustments, enabling precise matching of pressure, injection frequency, and nozzle aperture according to the specific characteristics of different fluids.
Blocking the hole is Piezoelectric valve The most common failures in dispensing operations are often caused by fluid solidification, residual impurities, and nozzle wear, which directly affect dispensing accuracy and efficiency. Given the structural characteristics of piezoelectric valves, these issues can be addressed in three steps: “diagnosis—cleaning—inspection.” First, stop the machine and visually inspect the nozzle for obvious glue deposits or foreign objects, determining whether the blockage is temporary or a persistent issue caused by nozzle wear.
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